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The authors wish to express their thanks to the personnel of the Semiscale Facilities and Test Operation Branch for their efforts in conducting the tests and collecting, verifying, and documenting the data; to the personnel of the Semiscale Data Processing Section for providing data processing support; to P. North and D. J. Hanson for their technical advice and overall contributions to improve the quality of this document; to C. P. Fineman for supplying many of the RELAP4 calculations; to K. A. Dietz for her technical review and editing contributions; and to Elinor Witbeck and Evelyn L. Pierson for their typing and proofreading efforts.

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