A new industrial electrodeposition of copper in an acidic medium using an environmental cinnamon extract has been developed. The obtained coatings were adherent and uniform, and their deposition rate has reached 23 µm/h. In addition, their quality has been improved by cinnamon extract addition. Cyclic voltammetry and electrochemical impedance spectroscopy have showed that the electrodeposition mechanism depends on the electrolyte constituents and the additive presence. The SEM observation indicated that the coatings morphology has been improved by cinnamon extract addition.