In this work, preliminary results of a study on printed power combiners configurations for power-amplifier applications are presented. The proposed configuration is based on Substrate Integrated Waveguide (SIW) and multilayer PCB technologies. In particular, a printed horn combiner/divider was considered as a basic building block of a power combining amplifier. Simulated results of the passive combiners will be presented and discussed along with measured results.

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In this work, it is presented a new configuration of planar power combiner/divider based on an H-plane sectoral horn antenna. This component is proposed to realise the basic building blocks of printed power-combining amplifiers. It will be shown how the sectoral horn elements can be implemented on substrate integrated waveguide and multilayer printed circuit board technologies, thus obtaining a high integration level. In the following, the design procedure will be described reporting an example of an 11-stage power divider/combiner in C-band. A prototype has been fabricated, and the measured results compared with the numerical model. Experimental results are in good agreement with theoretical expectations showing a single-stage efficiency of about 90% and a bandwidth of 40%.