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Matrix-assisted laser desorption/ionization (MALDI) and Fourier-transform ion cyclotron mass spectrometry (FT-ICR-MS) are combined for the characterization of polyoxyalkyleneamines. 1H and 13C NMR data are used to confirm and quantify structural assignments. Characterization of the molecular weight distribution, chemical composition distribution, and end group distribution of amine-terminated (co-)polymers of ethylene oxide and propylene oxide is rather complex because the convolution of these three entities yields an ensemble of structurally related molecules which is hard to characterize by conventional analytical techniques. In this study MALDI FT-ICR-MS is used to resolve intact, Na+ cationized, oligomer ions in the mass range from m/z 500 to 3500. This revealed the presence of various compositional distributions in the polyoxyalkyleneamines. The individual compound masses in the molecular weight distributions were measured with a mass accuracy of <20 millimass units, allowing end group and repeat unit determination with an accuracy of better than 50 millimass units. NMR is used to measure the average end group distribution to provide insight in conformational differences. In this respect, FT-ICR-MS data and NMR data are complementary. The combined results yield detailed information about chemical composition distributions of polyoxyalkyleneamines that hitherto it was not possible to obtain with either technique separately.

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A novel low temperature process for titanium nitride (TiN) deposition by means of an electron cyclotron resonance (ECR) plasma CVD process was applied to poly(tetrafluoroethylene) (PTFE). The organometallic compound tetrakis(dimethylamido)titanium (TDMAT) introduced into the downstream region of a nitrogen ECR plasma was used as a precursor for TiN deposition at 100°C.The thin TiN films (thickness 15-30 nm) act as interlayers to activate the electroless deposition of copper followed by an electroplating process. Prior to the deposition of the interlayer, the samples were treated on a biased susceptor with argon ions to enhance the adhesion of the TiN interlayer. This metallization procedure avoids the use of toxic and pollutive etching agents and yields adherent copper layers on PTFE.The maximum adhesion of the metal film on PTFE was established to be 13 N/mm2. As shown by atomic force microscopy (AFM), TiN grains were formed on the fluoropolymer surface. Film composition was investigated by secondary ionization mass spectrometry (SIMS).