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The High-Speed Optoelectronic Memory Systems (HOLMS) project, sponsored by the European Union Information Society Technology program, aims to make the use of board level optical interconnection in information systems practical and economical by developing optoelectronic packaging technology compatible with standard electronic assembly processes. To demonstrate the potential of the technology, it develops a demonstrator system that addresses the most pressing problem of contemporary computer architecture: memory latency. This paper describes the key ideas and some preliminary results of the HOLMS projects focusing on the electronic interconnection technology, in particular optoelectronic packaging issues.

The completed detailed design and initial phases of construction of an optoelectronic crossbar demonstrator are presented. The experimental system uses hybrid very large scale integrated optoelectronics technology whereby In CaAs-based detectors and modulators are flip-chip bonded onto silicon integrated circuits. The system aims to demonstrate (a 1-Tb/s aggregate data input/output to a single chip by means of free-space optics