The phenomenological model of laser joining at so called boundary kitetic is developed. The criteria of microjoints strength is suggested. As a result of kinetics of computer simulation of soldered joints forming, practical investigations of soldering modes influence at the joints strength and analysis of micro section metallographic specimens fulfilled with the aid of electronic microscope, the possibility of two-three fold enhancement of soldered joints strength in comparison with manual soldering. Technological process and automated equipment are developed for laser soldering of electronic components with planar leads at the printed circuit boards.
The systems of pulse-periodical pumping of the solid-state lasers with adjustable time-amplitude and frequency parameters as of pulses of pumping currency, as well of laser radiation pulses, intended for power supply of the lasers, operating in the mode of free generation, are presented.
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