The use of nanoparticles appears to be a feasible option for improving the quality of a range of wood-based products. Studies show that they can improve both the physical and mechanical properties of wood and wood-based products. This preliminary study aimed to analyze the influence of SiO2 nanoparticles on the physical and mechanical properties of wood particleboard. To this end that, panels were produced without the addition of SiO2 nanoparticles and with the addition of 4% by mass of the urea formaldehyde adhesive used for its production. The results showed that panels produced with the nanoparticles 42% reduction in thickness swelling of the panel. Therefore, the dimensional stability of the panels without decreasing mechanical properties, even when used in small proportions.