A robotic cloud laboratory driven by a state-of-the-art unified laboratory operating system integrates automated hardware, humans, and sensors. This lab of the future system enables researchers to transparently and collaboratively create, optimize, and organize biological experiments to achieve more reproducible results, perform around-the-clock experimentation, and more efficiently navigate the vast parameter space of biology.

Abstract-Plastic electronic packages are known to absorb moisture when exposed to humid ambient conditions during storage in tape and reel in the factory. Reliability becomes a concern when packages are exposed to a humid environment for a prolonged time and then processed through a reflow oven. Thermo-mechanical and moisture induced interfacial stresses generated between the die attach and die may lead to die delamination and package cracking. Current package level moisture evaluation methods are based on experimental weight gain measurements and visual inspection after reflow for cracking or delamination. This study presents a finite element analysis (

No abstract