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of the product of the total resistance and capacitance of the IC performance and cost drive interconnect dimensions to whole interconnects structure. Lowing the dielectric constant shrink to ever-smaller sizes the RC delay becomes the between the interconnect layers and copper metallization dominant factor to impact IC performance. The RC delay is a became necessary.[1]. function of the product of the total resistance and capacitance Low-k is generally defined as K value of less than 3dusow of the whole interconnects structure. To reduce RC delay, k materials are introduced to the semiconductors industry copper interconnects were introduced to replace aluminum. At mainly to improve capacitance, device speed, and signal