The technological progress made in recent years has driven electronic apparatus to become not only more efficient and work faster but also considerably smaller in weight and size. Furthermore, the power densities of these devices have known an impressive increase. However, the challenge for the electronic industry is the lifetime device improvement by controlling the adequate removal of their excess heat. The use of more efficient cooling systems is, therefore, crucial in order to ensure durable device functionality. In this work, computational simulation was carried out to study the enhancement cooling process mixed convection of an electronic component (CPU mounted in a motherboard) using a new design of a heat exchanger by combining the heat sink (the finned surface) and the fan in a single component, this allows more heat to be moved faster and with less energy than a conventional cooler. Three radial heat sinks (HS18, HS24 and HS36) are considered depending on circumferential fin numbers ( n  =  18, 24 and 36). The effect of Reynolds number, heat flux and rotational velocity is investigated, and the optimum comprehensive performance was determined. The results reveal the cooling performance turns out to be better for heat sink with n  =  36. The rotational velocity operates a significant effect on the temperature field only for values below than 900 rpm. We also found that the improvement in the Nusselt number and its percentage enhancement is intensified with increased rotational velocity and decreased with heat flux. A bigger Ω and ReΩ meant a more obvious heat transfer enhancement (NuΩ/Nu0) in the case of smaller Q, but (NuΩ/Nu0) decreased with increasing Q.