A low-cost, manufacturable, thermally actuated, plastic microfluidic valve has been developed. The valve contains an encapsulated, temperature-sensitive fluid, which expands, deflecting a thin elastomeric film into a fluidic channel to control fluid flow. The power input for thermal expansion of each microfluidic valve can be controlled using a printed circuit board (PCB)-based controller, which is suitable for mass production and large-scale integration. A plastic microfluidic device with such valves was fabricated using compression molding and thermal lamination. The operation of the valves was investigated by measuring a change in the microchannel's ionic conduction current mediated by the resistance variation corresponding to the deflection of the microvalve. Valve closing was also confirmed by the disappearance of fluorescence when a fluorescent solution was displaced in the valve region. Valve operation was characterized for heater power ranging from 36 mW to 80 mW. When the valve was actuating, the local channel temperature was 10 to 19 degrees C above the ambient temperature depending on the heater power used. Repetitive valve operations (up to 50 times) have been demonstrated with a flow resulting from a hydrostatic head. Valve operation was tested for a flow rate of 0.33-4.7 microL/min.

Qubit information processors are increasing in footprint but currently rely on e-beam lithography for patterning the required Josephson junctions (JJs). Advanced optical lithography is an alternative patterning method, and we report on the development of transmon qubits patterned solely with optical lithography. The lithography uses 193 nm wavelength exposure and 300-mm large silicon wafers. Qubits and arrays of evaluation JJs were patterned with process control which resulted in narrow feature distributions: a standard deviation of 0.78% for a 220 nm linewidth pattern realized across over half the width of the wafers. Room temperature evaluation found a 2.8 − 3.6% standard deviation in JJ resistance in completed chips. The qubits used aluminum and titanium nitride films on silicon substrates without substantial silicon etching. T1 times of the qubits were extracted at 26 µs -27 µs, indicating a low level of material-based qubit defects. This study shows that large wafer optical lithography on silicon is adequate for high-quality transmon qubits, and shows a promising path for improving many-qubit processors.

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