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Anodization of die-casted AZ91D magnesium alloy was carried out using silicate based electrolyte solution instead of fluoride based solution to improve biocompatibility of oxidized layers. The anodic layer obtained from silicate based solution has smaller size of pore and smoother surface, resulting in lower corrosion rate in simulate body solution (SBF). Effect of enhanced structural and chemical properties in oxidized layer on biocompatibility was carefully considered.

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The primary purpose of this research is to investigate how much the complexing agent in electroless Cu electrolytes will affect adhesion strength between copper film and Ta diffusion barrier for Cu interconnect of semiconductor. The adhesion strength using rochelle's salt as complexing agent was higher than the case of using EDTA-4Na. Effect of complexing agent on adhesion strength and electrical resistivity was studied in crystal structural point of view.

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