Wafer thinning is a crucial technique for high‐efficiency solar cells. Herein, an inverted pyramid (IP) texture is prepared on a 35 μm‐thick flexible silicon (Si) wafer with a standard area of 156 × 156 mm2. Based on the experimental results, an ultrathin bifacial passivated emitter and rear cell (PERC) with IP textures using PC1D simulation is designed. The influence of wafer thickness, IP texture, bifacial structure, thickness of the antireflection coating, and doping concentration on device performance is investigated. The results show that the ultrathin IP‐based bifacial PERC possesses better output performance than the traditional cell. Finally, a simulated maximum efficiency of 23.44% is obtained using PC1D software, with an open‐circuit voltage of 0.7127 V and a short‐circuit current of 9.272 A. This ultrathin PERC with IP textures provides an effective way to improve the efficiency of ultrathin silicon solar cells.