In this paper, the split power planes with electromagnetic bandgap structures enhancement is proposed for the wideband suppression of ground bounce noise in high-speed printed circuit boards. A systematic design procedure is presented, featuring a modified analytic design formula, a novel compact electromagnetic bandgap layout, and a discussion on the minimum number of cascaded rows. As it is capable of selectively suppressing the ground bounce noise at several desired frequencies, the approach is applied to deal with the coupled noise between two isolation islands and the ground bounce noise induced by signal line crossing the split power planes. Successful noise suppression over an ultrawide band from dc to 5 GHz and reduction of the peak ground bounce noise in the time domain by 75% by an electromagnetic bandgap strip 1.44 cm wide is demonstrated. Good agreement is seen from the comparison between simulation and experimental results.

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