In flexible display fabrication, removing the flexible substrate from the rigid carrier glass, without damaging the OLED or the TFT devices, is considered difficult. This particular manufacturing process is referred to as the de‐bonding process. This report provides a simple method to attain a de‐bonding layer which can be applied in a very high temperature process over 450°C. The range of peeling force after the array process can be adapted from 4 to 20 gf.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.