In this work, we propose a compensated temperature pressure sensor fabricated on compound LiNbO 3 /Quartz/Quartz substrates obtained by Au/Au bonding at room temperature and double face lapping/polishing of LiNbO 3 /Quartz stack and a final gold bonding with a structured Quartz wafer. This paper shows the possibility to obtain device which is intrinsically low sensitive to thermal effects, and even allowing a second order compensation thanks to the Quartz thermal stability Sensitivity of the final sensor to bending moments then is tested and results show pressure sensitivity of such devices.

No abstract