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A survey, comparison, and critical analysis is presented of data compiled from the scientific literature concernmg diffusion m copper• sIlver and copper-gold systems. Here the term "copper alloy system" is interpreted in the broadest s•ense. For example, the review of diffusion in the Cu-M system reports all diffusion situations which involve both copper and element M, including diffusion of Cu in M or in any binary, ternary, or multicomponent alloy containingM: diffusion of Min Cu or in any alloy contaiping Cu; and diffusion of any element in any alloy containing both Cu and M. Topics include volume diffusion, surface diffusion, grain boundary diffusion, tracer diffusion, alloy interdiffusion, electromigration, thermomigration, strain enhanced diffusion, and diffusion in molten metals. An extensive bibliography is presented along with figures, tabular presentation of data and discussion of results.

A survey, comparison, and critical analysis is presented of data compiled fr.om t~e sci~nt~c literature concerning copper self-di1fusion. Topics include volume diffusion, dislocat1o~ PI~ diffus~on, surface diffusion, sintering, electromigration, thermomigration, pressure effect on diffuSlO~, st~am~nhanced diffusion nuclear magnetic resonance measurements of solid state diffusion and diffUSion m molten copper. An extensive bibliography is presented along with ligures, tabular presentation of data, and discussion of results.