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In the TSV electromigration test process, this paper has carried out relevant research on how to accurately measure TSV resistance and make it conducive to the observation of standard instruments, aiming at the problem that the resistance value of TSV reaches the magnitude of a microburst. Observing the resistance value change in the electromigration process is challenging. This paper analyzes and designs a measurement circuit for TSV. This circuit uses the cascade of an integrated amplifier. It combines with the four-probe method to amplify the TSV resistance change signal based on accurate measurement of TSV resistance, which is more conducive to the measurement of standard instruments and makes it easier to observe the change of resistance when TSV electromigration occurs.