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International audienceThe continual trend of miniaturization and increasing complexity in the field of Radio Frequency (RF) devices poses a challenge for today's manufacturing technologies. The possibility of miniaturization of RF components with Molded Interconnect Devices (MIDs) is very attractive. However, electromagnetic properties of MID substrates based on polymer materials and behavior of RF basic components designed on MID substrates are not well known in the literature. In this paper, some MID substrates complex permittivity measurements and dielectric losses measurements are presented and exploited to design RF basic components. LCP Vectra E820i is used for the realization of transmission lines and a low pass filter in Coplanar Waveguide (CPW) technology by Laser Direct Structuring (LDS). Measurements, which are in good agreement with simulations, make MIDs good candidates for RF applications

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International audienceIn this paper, microstrip transmission lines and antennas realized on Molded Interconnect Devices (MIDs) are presented. Measurements of two transmission lines realized by LDS on LCP vectra E820i substrate and inkjet printing on ABS PC substrates allowed the extraction of LCP vectra E820i and ABS PC permittivities. Measurement results show that lower losses are obtained with the LDS fabrication technique, validating thus the potential of MIDs for RF applications. The measurement results of the two microstrip patch antennas realized by Laser Direct structuring (LDS) on LCP vectra E820i substrate and inkjet printing on ABS PC substrate are made in good agreement with simulations