LED System-in-Package (SiP) aims to reduce manufacturing and material costs of LED lighting products through integration of components into one single package, based on semiconductor technology. This introduces multidisciplinary coupling in the system behavior which requires reconsideration of the existing LED design decomposition practice. This paper presents our method to do a decomposition analysis of the multidisciplinary coupling structure for an industry scale LED SiP design problem. The innovative aspect of our method is the use of a specification language to specify the input-output (binary) relationships between design variables, behavioral responses, objective and constraint responses. A design structure matrix, representing the mutual linkage, is automatically generated from the specification. The rows and columns of the DSM are subsequently re-ordered using partitioning and sequencing algorithms to provide insight in the coupling structure. The method is illustrated by means of a simplified example. This paper is a revised and extended version of proceedings paper "Decomposition-based analysis of the multi-physical coupling structure in LED System-in-Package design" presented by the authors at the 10th World Congress on Structural and Multidisciplinary Optimization, May 19-24, 2013 Subsequently, the results for a recently manufactured LED SiP design prototype are presented.

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