Abstract. The paper describes experimental study results for three kinds of enhanced surfaces (smooth surface, plain minifin surface and minifin surface with sintered perforated foil) and for two kinds of boiling fluids (ethyl alcohol and Novec TM 649). Novec 649 is considered to be an environmentally friendly alternative for electronic devices cooling applications. The experiments were carried out at atmospheric pressure. Compared with smooth surface, the surface with plain minifins provides approximately 1.5-times higher heat transfer coefficient obtained with Novec TM 649 and ethyl alcohol boiling. At low and medium heat fluxes minifins with porous covering produced the highest heat transfer coefficient.