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The pressure/temperature characteristics of the grey (semiconductor) tin→white (metal) tin transition in pure tin and dilute Sn–Ge alloys has been examined by following electrical resistance changes in strip specimens. It is shown that grey tin→white tin phase boundary has a slope of −48.4±6 K/kbar, in good agreement with thermodynamic predictions.

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Melt-spun Sn–Si alloy tapes were transformed to the grey modification at −30 °C to give compact specimens. On subsequent heating, the grey tin phase was seen to be stable to elevated temperatures, e.g., 90 °C for the Sn–0.6 wt % S alloy.

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