Abstract:To improve the oil-solubility of nanoparticles, a new technology was used to prepare a kind of lubricant containing titanium dioxide (TiO 2 ) nanoparticles. The microstructures of the prepared nanoparticles were characterized via transmission electron microscope (TEM) and infrared spectroscopy (IR). Tribological properties of TiO 2 nanoparticles used as an additive in base oil were evaluated using four-ball tribometer and ball-on-disk tribometer. In addition, the worn surface of the steel ball was investigated via polarized microscopy (PM) and X-ray photoelectron spectroscopy (XPS). The TiO 2 nanoparticles can be completely well-dispersed in the base oil under a new process (NP), which has no significantly negative effect on the anti-oxidation property. The results of the tribological tests show that TiO 2 nanoparticles under the NP show a better anti-wear property and friction-reducing property in base oil compared to TiO 2 nanoparticles under the tradition process (TP). The main aim of this paper lies in solving with the oil-solubility problem through the combination effect of surface modification and special blend process of lubricating oil. This method was first used to prepare lubricant containing TiO 2 nanoparticles and then used as additives in engine oil, gear oil, and other industrial lubricants. At the same time, tribological properties of TiO 2 nanoparticles in base oil as a lubricating additive were also studied.

No abstract

This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer. The paper aims at a better understanding of the planarization (polishing) and micromachining. The planarization becomes effective if the material removal rate (MRR) is optimal and the surface defects are minimal. The pH of the slurry plays a very important role in removing the selective layer by CMP, and hydrogen peroxide (H 2 O 2 ) is the most common oxidizer used in CMP slurry. The purpose of this paper is the analysis of the pH effect on the etching rate (ER) and on the behavior of selective layer polishing by a constant concentration of H 2 O 2 and the influence of nanoparticles size and concentration on selective layer surface CMP. The nanoparticle size used is 250 nm. The MRR results through CMP and ER have been shown to be influenced by the presence of oxides on the selective layer surface and have been found to vary with the slurry pH at constant H 2 O 2 concentrations. The CMP slurry plays an important role in the CMP process performance and should be monitored for optimum results and minimal surface defects. The paper analyzes the impact of chemical-mechanical, inter-nanoparticle, and pad-nanoparticle-substrate interactions on CMP performance, taking into account the state of friction at the interface, by measuring the friction force. Selective layer CMP optimization studies were required to control the chemical and mechanical interactions at the interface between the slurry and the selective layer, the slurry chemistry, the properties, and the stability of the suspended abrasive nanoparticles.