Diffusion of water molecules in novolak-based photoresist films commonly used in microelectronics is investigated. Thermogravimetry was used, in order to measure the diffusion constants of water molecules for temperatures ranging from 30 to 80°C. It is shown that the time to reach equilibrium with the surrounding atmosphere is only a few seconds for a dry 1 pm thick film of novolak-based positive photoresist.
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