In order to enable high-k metal gate technology, new CMP steps and slurries are needed to meet the stringent planarity and defect requirements for device performance. This paper will describe several of these slurry technologies in detail, including poly-openpolish, Aluminum CMP, and improvements required in Tungsten polishing. The keys to these technologies are outlined and polishing performance given in detail. The critical mechanisms involved in the material polishing for each of these steps are also introduced. All of these new technologies are needed in order to build a successful high-k metal gate device for advanced node integration via a replacement gate build strategy.

This report documents the accomplishments of the Phase III work under the DOE/NETL Cooperative Agreement No. DE-FC26-03NT41866 toward the development of Alstom Power's Chemical Looping process. All of the Phase III milestones have been met, on time, and within the budget. For the past several years Alstom Power Inc. (Alstom), a leading worldwide power system manufacturer and supplier, has been in the initial stages of developing an entirely new, ultra-clean, low cost, high efficiency power plant for the global power market. This new power plant concept is based on a hybrid combustion-gasification process utilizing high temperature chemical and thermal looping technology The process consists of the oxidation, reduction, carbonation, and calcination of calcium-based compounds, which chemically react with coal, biomass, or opportunity fuels in two chemical loops and one thermal loop.