Uneven brightness (Mura) will be observed in edge of active area (AA) which position corresponding to side of IC. This light leakage phenomenon is due to thermal stress after COG bonding. Discussing the mechanism and defining a method to evaluate quantitatively. It can be extended to study other stress Mura.

The film waving is a serious issue during design and experiment. Generally we have to change the design and do reliability experiments repeatedly . Based on finite element thermomechanical coupling simulation, this paper presents a method to find the influencing factors and quantify the criteria of waving.