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Correlation between HBM, MM and TLP testing is still under discussion. In this paper it is shown, that lack of correlation is caused by misinterpretations in the test results, due to the fact that soft and hard failures are often confused. This is illustrated by ESD results of test structures with grounded-gate NMOSTs and Field Oxide devices, measured according to Human Body Model, Machine Model and by means of Transmission Line Pulse testing. It is shown, that for a valid comparison, it is essential to combine electrical measurements with a thorough physical failure analysis in order to establish the failure signature. Once the failure signature and the current path are taken into account, a good correlation is found.

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