As the IGBT power modules have promising potentials in the application of the field of traction or new energy, the higher power density and higher current rating of the IGBT module become more and more attractive. Thermal resistance is one of the most important characteristics in the application of power semiconductor module. A new 1500A/3300V IGBT module in traction application is developed successfully by Zhuzhou CSR Times Electric Co., Ltd (Lincoln). Thermal resistance management of this IGBT module with high power density is performed in this paper. Based on thermal nodes network, an equivalent circuit model for thermal resistance of power module is highlighted from which the steady state thermal resistance can be optimized by theoretical analysis. Furthermore, thermal numerical simulation of 1500A/3300V IGBT module is accomplished by means of finite element model (FEM). Finally, the thermal equivalent model of the IGBT module is verified by simulation results.

This paper presents a novel patternable electrophoretic polymer (EPP) coating technology for sidewall package in microelectronic devices. The main features of this EPP film are directly patterned via through-mask electrophoretic deposition. The proposed EPP coating has some overwhelming merits against other coating polymers, such as self-patterning via through-mask deposition, good adhesive performance, selective coating, low cost and compatible with IC process. The focus is on the process, patterning, properties characterization and application of this novel electrophoretic polymer. The main applications can be aimed for electrical/thermal isolations or sidewall packaging in semiconductor device package.