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Measurement equipment for geometry, shape, surface finish of bare silicon wafers are highly sensitive tools operating partly at their capability limits. This results in performance problems which have to be solved if such equipment is to be of benefit for developing future generations of silicon wafers with specifications according to the SIA roadmap for semiconductors. The instruments for measuring the mentioned parameter belong to a class of tools the output of which is strongly influenced by their bandwidth. The requirements for future measurement equipment for specific measurement tasks as well as for generic capabilities which have to be met by all tools operating in a production ambient are outlined.

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