The present article concerns the metallization of silicon substrates by deposition of the nickelphosphorus alloy produced by an autocatalytic chemical process. The deposition electrolyte is composed of a metal salt, a reducing agent (sodium hypophosphite), a complexing agent (sodium citrate) and a buffer (ammonium acetate). The deposition could only be carried out after activation of the silicon by fixing catalytic species on its surface. The immersion of the silicon samples in palladium chloride made it possible to produce relatively thick and regular Ni-P coatings. The immersion time was optimized. The activation of Si was characterized by XPS and the Ni-P coating by XPS and SEM. The electrochemical study did not show any real mechanism changes compared to the Ni-P deposition on a conductive surface.

<p>The tin coating was elaborated electrolytically on an ordinary steel substrate in SnSO₄ based electrolyte in acid medium with additive (bis-glycobenzimidazolone) at ambient temperature. The pH is maintained at 1.2±0.2 Bis-glycobenzimidazolone influence on the electrochemical properties of the tin coating was investigated using stationary polarization, chronopotentiometry, and cyclic voltammetry techniques. These studies show an apparent decrease in cathodic peak current and a drop in potential. The deposition rate also decreases as the concentration of the additive increases.  SEM (Scanning Electron Microscopy) observation and XRD (X-ray Diffraction) analysis showed that the coating consists of good surface quality of the deposit elaborated by the addition of an optimal concentration of bis-glycobenzimidazolone (10^-3M) in the electrolyte, which constitutes the continuation of a preliminary study.<strong></strong></p>