Experiments were designed to investigate the influence of controlling sintering mechanism on electrical properties of multilayer PTCR chip. During the preparation process, heating rate, sintering temperature, high-temperature holding time and cooling method were respectively regulated to prepare multilayer PTCR chip with good performance. After the process of organic casting, the casting PTCR green films were sintered at 1 260-1 280 ℃ for 0.5 h at reduction atmosphere, which was heated at the rate of 400 ℃/h. Then selecting 300 ℃/h as the cooling rate, the ceramics were oxidated at 850 ℃ for 1 h. The prepared multilayer PTCR chips exhibited room temperature resistivity of below 100 Ω·cm, and resistance rising rate more than 104 unit through the Curie temperature.

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