This work presents an algorithm for simulating more accurate temperature distribution in two-phase liquid cooling for three-dimensional integrated circuits than the state of-the-art methods by utilizing local multi-linear interpolation techniques on heat transfer coefficients between the microchannel and silicon substrate, and considering the interdependence between the thermal conductivity of silicon and temperature values. The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively.

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