No abstract

The tetrabromobisphenol A epoxy resin (TBBPAER) was synthesized and Octa(aminophenyl) polyhedral oligomeric silsesquioxane (OAP-POSS) was used as a curing reagent of TBBPAER. The cure kinetics, the glass transition temperature, and the flame resistance of OAP-POSS=TBBPAER nanocomposites were investigated. The results show that the curing reaction could be described by the autocatalytic Š está k-Berggren (S-B) model. The average activation energy E a is 129.59 KJ=mol, the maximal mechanical loss temperature (T p ) is 166 C, when the molar ratio (N s ) of amino group to epoxy group is 0.5. The oxygen index for fire resistance is 46 $ 49 for different amounts of OAP-POSS.