This review summarizes the advances and challenges of shape memory polymer-based flexible electronic devices.

Shape memory polymers with high glass transition temperature (HSMPs) and HSMP-based deployable structures and devices, which can bear harsh operation conditions for durable applications, have attracted more and more interest in recent years. In this article, colorless and transparent shape memory polyimide (SMCTPI) films were subjected to simulated vacuum thermal cycling, atomic oxygen (AO) and ultraviolet (UV) irradiation environments up to 600 h, 556 h and 600 h for accelerated irradiation. The glass transition temperature (Tg) determined by differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) had no obvious changes after being irradiated by varying amounts of thermal cycling, AO and UV irradiation dose. After being irradiated by 50 thermal cycles, 10 × 1021 atoms cm–2 AO irradiation and 3000 ESH UV irradiation, shape recovery behaviors of SMCTPI films also had no obvious damage even if they experienced 30 shape memory cycles, while the surface morphologies and optical properties were seriously destroyed by AO irradiation, as compared with thermal cycling and UV irradiation. The tensile strength could separately maintain 122 MPa, 120 MPa and 70 MPa after 50 thermal cycles, 10 × 1021 atoms cm–2 AO irradiation and 3000 ESH UV irradiation, which shows great potential for use in aerospace structures and devices.

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