As the demand for flexible organic light-emitting diodes (OLEDs) grows beyond that for rigid OLEDs, various elements of OLEDs, such as thin-film transistors, electrodes, thin-film encapsulations (TFEs), and touch screen panels, have been developed to overcome OLEDs’ physical and chemical limitations through material and structural design. In particular, TFEs, which protect OLEDs from the external environment, including reactive gases, heat, sunlight, dust, and particles, have technical difficulties to be solved. This review covers various encapsulation technologies that have been developed with the advent of atomic layer deposition (ALD) technology for highly reliable OLEDs, in which solutions to existing technical difficulties in flexible encapsulations are proposed. However, as the conventional encapsulation technologies did not show technological differentiation because researchers have focused only on improving their barrier performance by increasing their thickness and the number of pairs, OLEDs are inevitably vulnerable to environmental degradation induced by ultraviolet (UV) light, heat, and barrier film corrosion. Therefore, research on multi-functional encapsulation technology customized for display applications has been conducted. Many research groups have created functional TFEs by applying nanolaminates, optical Bragg mirrors, and interfacial engineering between layers. As transparent, wearable, and stretchable OLEDs will be actively commercialized beyond flexible OLEDs in the future, customized encapsulation considering the characteristics of the display will be a key technology that guarantees the reliability of the display and accelerates the realization of advanced displays.
