The current challenging issues for terra-bit-level perpendicular STT-MRAM cells have been reviewed in the view of four critical parameters such as TMR ratio, Δ, J ex , and α. The TMR ratio of p-MTJ spin-valves are reaching to < 150% at the BEOL of >350 o C. A single MgO based p-MTJ spin-valve could not satisfy Δ of > 74, proposing a double MgO based p-MTJ spin-valve. J ex in SyAF layer adequately met > 0.7erg/cm 2 at BEOL of > 350 o C. A Co 2 Fe 6 B 2 based p-MTJ spin-valve limits to α of 0.005, necessary to develop a low α material such as full Heusler half-metal. Thus, an essential challenge in the future is to satisfy four critical parameters simultaneously at > 350 o C and 300-mm TiN electrode wafers.19.2.2 IEDM14-483

The Adhesion and removal of small particles to surfaces is very important to many industries such as semiconductor manufacturing, imaging, aerospace, etc. In most cases, particles represents undesirable contaminants that lower product yield and cause defects. These particulate contaminants may be generated by the process or the product environment. The industry sets threshold specification for acceptable contamination for each generation of products.

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