An overview of the driving forces for the increased importance of packaging and interconnection to progress in electronics is presented, with emphasis on the influence and importance of the role of polymers. Relevant information on market values for components is included, where appropriate. In addition, trends in interconnection and packaging, their combined role, and their market size are discussed.Examples are given in which plastic packaging can lead to substantial reductions in packaged IC cost. An extensive overview of polymer applications is presented, with special emphasis on thin films, protective gels, rigid encapsulants, and printed wiring board materials and processes. The chapter also indicates why the symposium and the book are timely and important, especially for those interested in the chemical aspects of these materials.From a number of standpoints, progress in electronics is becoming critically dependent on electronic packaging and interconnection. The ability to achieve fast clock rates, sufficient heat dissipation, uniform and appropriate electrical impedance, and high reliability and performance of packages, to name a few, are key requirements for which interconnection and packaging play increasingly important roles.In fact, it is projected that by 1995 the value added by packaging and interconnection will exceed that of the integrated circuit chips themselves in many more applications than occurs even today (1).Although a number of organizations and symposia have dealt with packaging, and to some extent with polymers, virtually none have emphasized the synthetic and physical chemistry aspects of these systems.For those reasons, we felt it was especially

Polymers of a new type with an unusual combination of properties have been synthesized. They are of high molecular weight, they are soluble in organic solvents, and they can be cast as films. Their electrical conduction is electronic in the solid state and can be controlled up to a conductivity of 10(-2) ohm(-1) cm(-1).

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