Abstract-A new formulation of the Wave Concept Iterative Process (WCIP) method is presented in this work. This approach uses an analysis with the longitudinal components instead of the transverse components. This approach includes decomposing the transverse TM modes into two longitudinal terms: the TM and TEM modes. This approach is applied to model a Vertical Interconnect Access VIA hole. The current density behavior is studied in the two cases with and without VIA hole. Also this method is used to study a SIW slot antenna. Compared to those obtained by available published data, our results show that the proposed method gives convincing results.

This paper proposes an efficient and fast analysis of substrate integrated waveguide (SIW) components using a new approach of the iterative method called WCIP, i.e. “Wave Concept Iterative Process”. This method is based on the iterative resolution of waves between two domains. The first is the spectral domain. We use the Floquet–Bloch decomposition to describe all modes in the spectral domain. The second describes the configuration of the circuit in the spatial domain. It allows taking the exact structure according to the appropriate boundary conditions. This method permits to reduce numerical complexity. The convergence of this approach is always guaranteed. The theoretical suggested study is validated by the simulation of two different examples of SIW circuits. The obtained results are in good agreement with those of measurement and with software HFSS simulations, which prove the advantage of this method.

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