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Biomechanical changes caused by structural foot deformities predispose patients to plantar ulceration. Plantar ulcer recurrence often leads to osteomyelitis, which is more commonly observed in patients with diabetes. Once the infection of diabetic foot ulcer (DFU) spreads and is complicated by osteomyelitis, treatment becomes more complicated and difficult. Osteomyelitis treatment remains challenging because of low drug concentration within the tissue caused by poor circulation and inadequate localized nutrition. Moreover, tissues around plantar ulcers are fewer and are thin, making the formation of granulation tissues difficult due to elevated plantar pressure. Furthermore, the skin around the wound is excessively keratinized, and the epidermis is hard to regenerate. Meanwhile, skin grafting at that site is often not successful due to poor blood circulation. Therefore, it is technically challenging to manage diabetic pressure plantar ulcer with osteomyelitis and prevent its recurrence. Here, we present a case of chronic DFU complicated by osteomyelitis due to foot deformity. The ulcer was successfully healed using advanced wound repair technology comprising of surgical bone resection, vancomycin-loaded bone cement implant, negativepressure wound therapy, and autologous platelet-rich gel. Subsequently, preventive foot care with custom-made offloading footwear was prescribed. The plantar ulcer did not recur and improvement in biomechanical parameters was observed after the intervention. This case represents an effective and comprehensive management strategy for limb salvage and prevention in patients with complicated foot conditions.

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A thin-film cochlear electrode array has been developed for a cochlear prosthesis to achieve improved sound perception and position accuracy. The array is fabricated using a bulk-silicon micromachining process that allows parylene deposition and patterning at wafer level, followed by a wet silicon release etch that is compatible with the use of boron etch-stops. The process is capable of realizing arrays with substrates stressed to hug the modiolar wall in the rest state and whose stiffness can be adjusted over a wide range. Built-in tip and curvature sensors respond to tip contact and bending-induced shank stress, respectively during in-vitro and in-vivo implants. The process is also compatible with the integration of parylene ribbon cables for lead transfer to an implanted electronics package.