A novel polytriazole resin prepared from pxylylene diazide (XDA) and N,N,N 0 ,N 0 -tetrapropargyl-p,p 0 -diaminodiphenylmethane (TPDDM) was synthesized and characterized. The resin is soluble in common solvents like acetone. The results show that the polytriazole resin can be cured at 708C. The glass transition temperature and thermal decomposition temperature of the cured resin are 218 and 3508C, respectively. The tensile and flexural strengths of the cured resin achieve 99.0 and 200 MPa, respectively.It is potential as a low cost and easy processing thermal resistant polymer matrix for advanced composite applications.

A novel low-temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70-C. The glass transition temperature T g and thermal decomposition temperature T d5 of the cured resin with the molar ratio of azide to alkyne group [A]/ [B] ¼ 1.0:1.0 reached 324 and 355-C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol S1 . The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185-C.Low temperature curing polytriazole resin 557 1608C/2hr, 1808C/2hr, and 2008C/2hr, the DSC curve of the cured A 3 B 4 resin is shown in Fig. 4. As shown in Fig. 4, there was no thermal effect in the whole scanning. This indicates that the curing reaction of A 3 B 4 resin has been completed. Thermal properties of the cured A 3 B 4 resinDMA of the cured A 3 B 4 resin was performed under nitrogen atmosphere. The result is shown in Fig. 5. The glass transition temperature of the cured A 3 B 4 resin reaches 3248C. Thermo-gravimetric curves of the cured A 3 B 4 resin under Scheme 1. Schematic polymerization of A 3 and B 4 .

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