In this paper, hyper-entanglement on polarization and energy-time is generated based on a silicon micro-ring cavity. The silicon micro-ring cavity is placed in a fiber loop connected by a polarization beam splitter. Photon pairs are generated by the spontaneous four wave mixing (SFWM) in the cavity bi-directionally. The two photon states of photon pairs propagate along the two directions of the fiber loop and are superposed in the polarization beam splitter with orthogonal polarizations, leading to the polarization entanglement generation. On the other hand, the energy-time entanglement is an intrinsic property of photon pairs generated by the SFWM, which maintains in the process of the state superposition. The property of polarization entanglement is demonstrated by the two photon interferences under two non-orthogonal polarization bases. The property of energy-time entanglement is demonstrated by the Franson type interference under two non-orthogonal phase bases. The raw visibilities of all the measured interference fringes are higher than 1/2, the bench mark for violation of the Bell inequality. It indicates that silicon micro-ring cavity is a promising candidate to realize high performance hyper-entanglement generation.

Great strides have been made over the past decade to establish femtosecond lasers in advanced manufacturing systems for enabling new forms of non-contact processing of transparent materials. Research advances have shown that a myriad of additive and subtractive techniques is now possible for flexible 2D and 3D structuring of such materials with micro- and nano-scale precision. In this paper, these techniques have been refined and scaled up to demonstrate the potential for 3D writing of high-density optical packaging components, specifically addressing the major bottleneck for efficiently connecting optical fibres to silicon photonic (SiP) processors for use in telecom and data centres. An 84-channel fused silica interposer was introduced for high-density edge coupling of multicore fibres (MCFs) to a SiP chip. Femtosecond laser irradiation followed by chemical etching was further harnessed to open alignment sockets, permitting rapid assembly with precise locking of MCF positions for efficient coupling to laser written optical waveguides in the interposer. A 3D waveguide fanout design provided an attractive balancing of low losses, mode-matching, high channel density, compact footprint, and low crosstalk. The 3D additive and subtractive processes thus demonstrated the potential for higher scale integration and rapid photonic assembly and packaging of micro-optic components for telecom interconnects, with possible broader applications in integrated biophotonic chips or micro-displays.

No abstract

No abstract

No abstract