No abstract

We developed a photosensitive film using a polymer blend for use in applications that require a high density of interconnects. Our film can be used as a dielectric or a passivation layer in high density packaging technologies. We formed vias about 20 μm in diameter using our new materials.

To improve the formability of high strength aluminum alloys (extra super duralumin 7075), the authors focused on two methods, semi-solid casting and Equal-Channel Angular Pressing (ECAP) processing. Solidified semi-solid cast samples of two different solid fractions were prepared. The samples were processed by ECAP, and the improvement in mechanical properties were investigated. Improvement in ductility increased with lower solid fraction. Four-pass ECAP-processed semi-solid cast AA7075 had higher strength and ductility than wrought AA7075-O.