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Deep-reactive ion etching of n-doped silicon-on-insulator is utilized to make ion optical components to aid in the miniaturization of mass analyzers. The microelectromechanical system components are bound to aluminum nitride substrates and employed three-dimensional assembly. The assembly methods are tested for breakdown (V(b)), durability, and alignment. Demonstration of ion manipulation is shown with a 1 mm Bradbury-Nielsen gate, 500 mum Einzel lens, 500 mum coaxial ring ion trap, and reflectron optics. Data are presented showing the resolution, attenuation, and performance of each of these devices. We demonstrate advantages and disadvantages of this technology and its applications to mass analysis.

Fabrication of nanoelectromechanical systems in single crystal silicon using silicon on insulator substrates and electron beam lithographyWe report a novel microcolumn fabrication method using automated micro-electromechanical-systems (MEMS) assembly. Different microcolumn components, including deflectors, lens elements, and apertures, are fabricated on a highly doped 50 m thick silicon-on-insulator (SOI) wafer. These components with compliant connectors are then assembled onto compliant MEMS sockets fabricated on the same wafer using MEMS NanoEffectors™ and automated assembly. The self-aligning nature of MEMS sockets yields submicron lateral alignment and less than 0.1°angular misalignment. The measured resonant frequency is 593 Hz for first generation assembled components; the footprint of the microcolumn is less than 1 cm 2 . We have successfully built a mechanical prototype microcolumn for technology demonstration and as a proof of concept. Second generation design is under development.

Directed microassembly and nanoassemhly is performed by using appropriately-sized end-effectors coupled to macrorobotic systems. The larger end-effectors are made via microelectromechanical systems (MEMS) fabrication processes and can handle components ranging from hundreds of microns in size down to ten nanometers. Smaller endeffectors are etched tungsten probes capable of manipulating nano-scale objects. We demonstrate automated and semiautomated microscale assembly while nanoscale assembly is currently done only in semi-automated ways. Resultant assembled devices include three-dimensional MEMS assemblies and carbon nanotuhe structures.