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Thick SOI technology has achieved commercial success in plasmadisplay-panel (PDP) driver ICs. The present paper will give a review on the technology trend of PDP driver ICs and an outlook of the application status of thick SOI technology to PDP driver ICs. Thick SOI technology brings such merits as high device packing density, complete isolation and the integration of high-voltage and high-current devices to power and/or high-voltage ICs. PDP driver ICs need thick SOI, because it is possible to achieve the highest IC performances including cost by utilizing these merits.