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The packaging of a miniaturized NIR-spectrometer is demonstrated. The heart of this NIR-spectrometer is an electrically tuneable silicon surface micromachined Fabry-Perot interferometer (FPI). For reliable operation, the FPI device has to be mounted so that thermo-mechanical stresses are not present in its active area. This can be realized basically by mounting FPI on a substrate that has a thermal expansion coefficient (TCE) close to silicon, using elastic material for mounting or minimizing the joint area between FPI and substrate. The FPI provides the possibility for the manufacturing of a miniaturized single-axis NIR-spectrometer for large-volume applications.

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The trends in optoelectronic products are towards higher integration level of optics, electronics and mechanics. It means smaller dimensions and tighter packaging density. The precisions in component manufacturing and accuracies in module assemblings typically are in 10 to 50 micrometer range. Due to demands of the production in series of tens of thousands it means new type of know-how in production and assembling technologies.