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A research has been carried out on the optimization of the shape of encapsulating cover to minimize optical losses in light-emitting modules fabricated with the ''chip-on-board'' (COB) technology. Optical properties of the components of a typical COB were taken into account including those of the substrate, light-emitting chips, encapsulating material and phosphor particles. Light losses were analyzed for various types of encapsulant surface structuring in an attempt to design an optical element with maximum light extraction efficiency. Calculations were complemented with experimental measurements. The results of the research showed that structuring the surface of the encapsulant can enhance light extraction by 10 to 15% for the material without phosphor particles and by 10 to 14% for the material with phosphor particles. #

This paper discusses the design optimization of LEDs fabricated using chip-on-board technology. Light losses are analyzed, and an attempt is made to create an optical element that maximizes the lightoutput efficiency from the chips. Experimental measurements of test samples are made, and optimization calculations are carried out using the ZEMAX software package. As a result of the studies, an optimized shape of the optical element is obtained that makes it possible to reduce the light losses in the device by 10% by comparison with the initial design.

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