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We report on the realization of a multi-emitter quantum cascade laser system with optimized package volume. A multidimensional bonding of chip-on-substrate units allows for close packaging of several chips. The emission of several chip-on-substrate units with an emission wavelength around 3.9 µm are geometrically combined to achieve a multi-Watt emission power level while obtaining a symmetric beam profile of the emission. A dedicated integrated electronic circuit provides individual pulse control, which enables individual timing for each emitter.

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