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1.NBSTRACTAn analysis of the main contributors to the quality aidcost of complex board manufacturing is presented. Manufacturing data from three boards built at Hewlett-Packard and simulation models are used to derive the sensitivity of quality and cost versus ,Surface Mount Technology (SMT) solder defect rate, component functional defect rate and test coverage. A new Yield model which accounts for the clustering of solder defects is introduced and a first order estimation of the cost of implementing the IEEE 1149.1 standard on A S K S is given.

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