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ChemInform Abstract Electrodeposition of Pb from a PbCl2/NH4OAc/HOAc solution is performed by linear and cyclic sweep perturbation in the temp. range 25-75 rc C using polycrystalline Pb, Cu, Ag, and C substrates. An increase in temp. is found to accelerate the deposition process and promotes dendrite formation. AES results show a strong influence of Cl-on the Cu electrode resulting in a lower coverage of Pb monolayers, whereas the opposite effect is observed for the Ag electrode.