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Power die Fig. I. Structure of the failed digital-analog mixed IC and self heating configurationoperating temperature was from -40°C to 125°C. When current [load pulled out of the output, power die was heating up and the heat conducted to control die through lead frame. If the failure isolated in control die, it is possible to do failure analysis at high temperature. To control the temperature in a high degree of accuracy, self-heating should be developed.-., ,-L-Jr----1 Digital Analog 1 1 J 1 Pan Pan:Ṽ Dĩ